Project Call 9.0
About
NextFlex Project Calls fulfill one of the Institute’s primary goals: fostering technology innovation and commercialization.
Project Call (PC) 9.0 is the ninth project call issued by NextFlex. Like the previous project calls, it is intended to advance the state of the art in manufacturing for hybrid electronics and to promote the strength, competitiveness, and interconnectedness of the U.S. manufacturing ecosystem for hybrid electronics. Each NextFlex project call has a unique character and implements changes relative to past project calls, and all proposers should carefully read all sections of this guidebook to understand changes in proposal development, required content, submission, evaluation, eligibility, and selection criteria. Important considerations for PC 9.0:
- Proposal process will be 1-stage (straight to full proposal) – there is no pre-proposal round
- Discussion with NextFlex during proposal development is strongly encouraged to ensure that proposals align to the goals of the topics
- Projects are expected to be technically focused and of modest duration (maximum duration from 12 to 18 months, by topic)
- Topic areas are broadly defined, allowing proposers to determine the specific subject of their proposal; proposals should explain the importance and relevance of the chosen subject
- Alignment of proposals to DoD Critical Technology Areas is strongly encouraged (for more information, see https://www.cto.mil/usdre-strat-vision-critical-tech-areas/)
- Projects that leverage prior NextFlex investments and that address technology transitions are encouraged.
- Cover sheets are due on July 24, 2024 and final proposals must be submitted by 5 PM PT on July 31, 2024.
Topics for PC 9.0 include:
- Topic 9.1: Manufacturing of High Resolution, Multilayer Electronic Packages and Devices
- Topic 9.2: Thermal Management for Power Electronics
- Topic 9.3: Reliable Hybrid Electronics for Extreme Conditions
- Topic 9.4: Conformal & Structurally Integrated Hybrid Electronics
- Topic 9.5: Additive Processes for Improved Environmental Sustainability of Electronics Manufacturing
- Topic 9.6: Open Topic for “New Project Leads”
NextFlex hosted a virtual Proposer’s Day and Teaming Event on Monday, June 10 at 10am PST. The teaming event provided attendees with the opportunity to share their proposal ideas, technical capabilities, and connect with potential project collaborators.
PROJECT CALL REFERENCE DOCUMENTS
- Project Call 9.0 Cover Sheet Submission Form
- Project Call 9.0 Proposal Submission Form
- Project Call 9.0 Guidebook
- Project Call 9.0 FAQs
- Cost Proposal Template
- Project Call 9.0 Summary PPT Template
- Cost Share Definitions and Guidance
- Hybrid Electronics Manufacturing Roadmap Summary
- Manufacturing Readiness Level (MRL) Webinar
In March 2023, NextFlex hosted a webinar on MRLs, including MRL & TRL background, classifications/substantiation, and how they can be used within NextFlex Project Call proposals. View Webinar Slides | View Recorded Session - PC 9.0 Virtual Proposer’s Day & Teaming Event
