An Interview with Nick Koop, Director of Field Application Engineering at TTM Technologies
Q: Nick, can you tell us about your role at TTM and the focus of your organization?
A: I am the Director of Field Application Engineering for the Aerospace and Defense business unit of TTM. TTM is a leading global RF and specialty components, advanced technology, and PCB fabrication solutions supplier.
Q: You are a very strong supporter and a recognized leader in hybrid electronics manufacturing. How did you find your passion for this emerging technology?
A: I believe these additive technologies have a place in the manufacturing ecosystem. There are definitely places where these developing technologies may be inserted to existing systems to either reduce costs or increase performance, or both.
Q: What is a key innovation that will enable widespread adoption of FHE and related technologies, and what application areas are you working in?
A: From my point of view, there are two keys to widespread adoption – established reliability of specific solutions as well as demonstrated volume capacity. We continue to evaluate both conductive and dielectric inks, with an eye on how to implement them into new product offerings.
Q: You have been an active participant in Project Calls, Technical Working Groups, and many member events. What upcoming activities are you most excited about?
A: TTM has been a contributing member in select Project Calls. I am a NextFlex Fellow and have been active on technical working groups as well as a participating member of certain NextFlex events, providing a manufacturer’s perspective on industry needs. I am interested to see the Project Call 9.0 come together. I think there will be opportunities to really advance some technologies close to production readiness.
Q: You have been an active member of NextFlex and have participated in a variety of ways. What has the membership experience been like for you?
A: I find that I learn as much when just attending as I do when we directly participate. Each has its own benefits. When we attend events, we are able to scan a wide range of technologies rapidly. When we participate on project calls, we are given the opportunity to dive in deeper. Together, we can look wide, and then dive deep where it piques our interest.