Advanced Packaging Workshop Report Discussion

Members and subject matter experts convened at NextFlex on January 18 and 19 to explore and align opportunities for flexible and additive hybrid electronics for semiconductor packaging. Attendees broke into four groups for solutions gathering and prioritization to identify ways for how the industry can shape the future of U.S. packaging capabilities. Four key themes were addressed by the attendees: Direct Write Interconnects; Substrates and Build-up Layers; Interposers, Bridges & Architectures, and Circuitization. Solutions that were identified will inform not only potential NextFlex Project Call topics, but also proposals for opportunities that may arise from the CHIPS and Science Act or other programs.

A report of the findings from the workshop will be delivered during this webinar.

Agenda:

1. Introduction
2. Breakout Session Reports
   1. Breakout Topic: Direct Write Interconnects
      1. Key Technical gaps identified
      2. Proposed solution
   2. Topic: Substrates and Buildup
      1. Key Technical gaps identified
      2. Proposed solutions
   3. Breakout Topic: Interposers, Bridges & Architectures
      1. Key Technical gaps identified
      2. Proposed solutions
   4. Breakout Topic: Circuitization
      1. Key Technical gaps identified
      2. Proposed solutions
3. Conclusion/Next Steps