NextFlex Member Meetings at FLEX 2019

NextFlex members convene for a Technical Council, a Governing Council meeting, a Member Reception, and a Technical Working Groups meeting (“Member Meetings”) once again at the annual FLEX Conference at Monterey, California, to advance U.S. manufacturing of flexible hybrid electronics.

There is no cost to attend NextFlex Member Meetings. NextFlex members receive a member discount to attend the FLEX Conference; no code is required.

SCHEDULE

WED, FEB 20

12:00-1:30 PM: Technical Working Groups (TWG)

All TWG members are invited to an update on the current status of the FHE Process Design Kit (PDK) and the Modeling & Design Roadmap. During short breakout sessions, we will solicit ideas and prioritization of next steps for both the PDK and multi-physics modeling tools.

Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).

THU, FEB 21

12:00-4:00 PM: NextFlex Technical Council Meeting

Attendance is limited to Technical Council Voting Members only.

1:30-5:00 PM: NextFlex Technology Standards and Roadmapping Discussion 

• Chris Jorgensen of IPC will lead discussion of FHE Standards – their importance, their current status, and a path forward to addressing the gaps.
• NextFlex members AFRL, Kuprion, Averatek, and Sandia National Lab will discuss their unique FHE capabilities and opportunities to collaborate with their teams.

Government partners and all NextFlex members are welcome, including Observer-level members.

4:00-6:00 PM: NextFlex Governing Council Meeting

Governing Council members only.

6:00-9:00 PM: Evening Member Event

Network with fellow NextFlex members at Scales Seafood & Steaks on the wharf of Monterey Bay.

Government partners and all NextFlex members are welcome, including Observer-level members.

FRI, FEB 22

8:00 AM-12:00 PM: NextFlex Project Update Technical Council Meeting

Project Updates and key outcomes of Mechanical Test and Reliability Projects, as well as other projects

• Lockheed Martin (Binghamton University) – Conformal Printing of Conductor and Dielectric Materials onto Complex 3D Surfaces
• MicroConnex (University of Washington) – Bulk conductivity High-density interconnects
• University of Massachusetts, Lowell (DuPont, Raytheon, Jabil) – Test Methods for Electrical and Mechanical Durability of Flexible/Rigid Interfaces in Multi-Axial Fatigue and Dynamic Loadings
• Binghamton University (DuPont, GE, Georgia Tech) – Assessment and Optimization of the Reliability of Wearable Performance Monitors
• Auburn University (Optomec) – Mechanical Test Methods for Flexible Hybrid Electronics Materials and Devices
• Georgia Tech (DuPont, Binghamton) – Development of Test Methods and Standards to Assess Reliability of FHE Components and Systems

Attendance is limited to government personnel and NextFlex members from Tiers 1, 2, and 3 only (multiple delegates welcome).

2:00 PM and 3:00 PM: Tour NextFlex’s state-of-the-art Technology Hub with NextFlex technical staff in San Jose, CA 

REGISTER

Unable to view the registration form? Contact us.

QUESTIONS?

Email or call 408-797-2247.