An Interview with HICAM

Together, HICAM is building partnerships to bring together emerging technology, business and product ideas, and industry support.

NextFlex News – December 2024

As I look to the coming year, I am very excited about the opportunities ahead for hybrid electronics. Every day brings new potential challenges for which NextFlex is well positioned to address, both in technology advancement and growing the US manufacturing…

NextFlex News – November 2024

Yesterday, it was announced that the U.S. Department of Commerce and the Semiconductor Research Corporation (SRC) are entering into negotiations to establish and operate a new Manufacturing Innovation Institute called SMART USA (Semiconductor Manufacturing…

NextFlex News – October 2024

Looking ahead to next month, we will be releasing an updated Hybrid Electronics Ecosystem Assessment. NextFlex members will have access to the entire report, and non-members will be able to view an abridged version on the NextFlex website.

An Interview with Dr. Devin MacKenzie, University of Washington

Devin is the technical director and co-founder at the Washington Clean Energy Testbeds at the University of Washington and I am also a faculty member in Materials Science and Engineering and Mechanical Engineering. His testbeds lab focuses on energy…

NextFlex News – September 2024

I am very excited to be writing to you as the new NextFlex Executive Director. My predecessor Dr. Malcolm Thompson established a solid foundation for growth and an environment for fostering collaborative innovation when he held the position.

Dr. Daniel Gamota Takes Over as NextFlex’s Executive Director

NextFlex Announces Appointment of Dr. Daniel Gamota as Incoming Executive Director to Lead Hybrid Electronics Manufacturing Institute

NextFlex Participates in Annual Pentagon Day

OSD ManTech hosted all nine of the DoD Manufacturing Innovation Institutes at the Pentagon on June 4th to enable a group of senior leaders to learn more about emerging technologies for defense applications.

Expanded Ecosystem Associate Member Spotlight: IS4S

We recently spoke to Sostenes Perez from NextFlex’s first Expanded Ecosystem Associate Member, Integrated Solutions for Systems, Inc. (IS4S).

NextFlex News – July 2024

As most of you know, NextFlex and its member partners submitted a concept paper to the NAPMP Materials & Substrates NOFO in May. Out of more than 100 concept papers, NextFlex was one of eight teams that were selected to submit a full proposal, which…

Interview with Carl Kalin, President of Biosensor Solutions

I am the President of Biosensor Solutions, a small but robust team focusing on assisting researchers, growers and food processors as they monitor and improve the microbiology of soil and food for sustainability, increased harvests and food security and…

NextFlex News – June 2024

As you may know, NextFlex submitted a 10-page concept paper in May along with over 100 other teams. We were delighted to be selected to move on to the next phase and the gathering of information now is moving forward in earnest.

NextFlex Launches $5.3 Million Funding Opportunity to Strengthen U.S. Electronics Manufacturing and Promote Commercialization of Hybrid Electronics

An Interview with Dr. Sai Avuthu, Specialist Engineer in Printed Electronics at Eaton Corporation

Eaton is a global leader in intelligent power management solutions, dedicated to improving quality of life and protecting the environment for people around the world. Our company is guided by a strong commitment to ethical business practices, sustainability…

An Interview with Eisuke Tsuyuzaki of Bayflex Solutions LLC

Our organization, based in San Jose, is a developer of a lab automation & data analytics platform that is dedicated to flexible & printed electronics. I myself tend to focus on outward activities; listening to customers and guiding our development…

May is Military Appreciation Month

As a DoD sponsored Manufacturing Innovation Institute, NextFlex is proud to mature technologies that will enable the warfighter. While we are certainly grateful for the service provided to us by those who wear the uniform, NextFlex is also proud to shine…

An Interview with Dr. Quevedo-Lopez of UT Dallas

Q: Dr. Quevedo-Lopez, what is your role at UT Dallas? A: I am the Department Head for Materials Science & Engineering and Director of the Center for Harsh Environments, Semiconductors, and Systems.

NextFlex News – May 2024

Dear Friends and Colleagues, I am very excited to be able to announce that we will be launching Project Call 9.0 this June. Like the preceding project calls, PC 9.0 is intended to advance the state of the art in manufacturing for Hybrid Electronics and…

An Interview with Nick Koop, Director of Field Application Engineering at TTM Technologies

Q: Nick, can you tell us about your role at TTM and the focus of your organization? A: I am the Director of Field Application Engineering for the Aerospace and Defense business unit of TTM. TTM is a leading global RF and specialty components, advanced…