How Will The Apple Vision Pro AR/VR Headset Boost 3D Printing?

An Interview with Dr. Chris Stoessel, Sr. Manager of Process Development and External Innovation, Eastman Chemical Co.

Eastman Chemical Co. is a specialty materials company and founding member of NextFlex. As a member of Eastman’s Global External Innovation team, I am Eastman’s Point-Of-Contact for all things “NextFlex” and I have coordinated our membership activities…

Improving Materials to Maximize Commercialization of Inkjet Additive Printing in FHEs

A key advance in recent years in the field of additive manufacturing of electronics has been in the quality and consistency of conductive inks for inkjet printing. This advance is a main reason why scalable printed PCBs, FPCB’s, and myriad Flexible Hybrid…

NextFlex News – May 2023

We are hoping to see many of you at our next workshop, The Hybrid Electronics Commercialization Path for Aerospace Applications, in Renton, WA on June 26 – 28.

Make It Where You Need It: OSD Program Funds Technology to Enable Point-of-Need Manufacturing

Join the Innovation Revolution with NextFlex and Manufacturing USA!

NextFlex Calls for 3D Imaging Technology Proposals

An Interview with Dr. Kenneth Church, Senior Scientist & CEO at nScrypt and Sciperio    

Many people have tremendous imaginations, but this rarely leads to realization. The challenge is to imagine without limits and then execute that into existence. A singular word that might describe people that can do this is visionary.

NextFlex News – April 2023

We at NextFlex are focused on hybrid electronics, while others focus on such things as wide-bandgap semiconductors, e-textiles, 3-D printing, lightweight metals, and other truly fascinating emerging technologies.

NextFlex – Building the Next BIG Thing in Flexible Hybrid Electronics

FHE Institute Calls for Proposals for Funding

NextFlex Announces 2023 Fellows Awards

NextFlex Convenes the Member Community March 28-29 to Stimulate New FHE Developments

NextFlex hosted the FHE community March 28-29 at the Technology Hub in San Jose, CA where 135 attendees from industry, academia, and government convened to provide technical updates on development projects, and to form collaborative teams for the eighth…

NextFlex Supports the Mentor Protégé Summit along with LIFT and America Makes

NextFlex participated in the “DoD Manufacturing Innovation Institutes (MIIs) and Manufacturing USA Panel” of the 2023 Mentor Protégé Summit.

NextFlex Promises $4.4M Funding to Advancing FHE and Electronics 3D Printing

An Interview with Rafael Tudela, Application Engineer, Tapecon Inc.

Tapecon Inc. – a medium-sized corporate NextFlex member – partners with product teams to develop, scale, and deliver better products through responsive and reliable printing, converting, and advanced manufacturing.

NextFlex News – March 2023

If you haven’t yet registered to attend our Winter Symposium on March 28 – 29 here at the Technology Hub in San Jose, please do so. It’s shaping up to be a fantastic event where we will launch our eighth project call.

Through the CA OPR CADENCE Program, NextFlex Provided Support for Eight Startups

In 2021, NextFlex was awarded $600,000 from the California Governor’s Office of Planning and Research (OPR) military affairs unit to support California’s defense innovation and advanced manufacturing ecosystem through small business development.

Lux Semiconductors Raises $2.3 Million for Microelectronics Packaging Technology

NextFlex News – February 2023

I’m looking forward to hosting you on March 28-29 at the NextFlex Winter Symposium here at the Technology Hub. Not only will we be launching our eighth project call in conjunction with the event, we also will be hosting a Proposer’s Day and Teaming event…