Reducing Industrial Emissions to Create an Equitable Clean Energy Future

NextFlex News – November 2022

As we head into the holiday season, it’s my great privilege to look back upon the past year and recognize the accomplishments of so many – our members, government partners, educators delivering FlexFactor® and other NextFlex Learning Programs and, of…

Advanced Packaging Gets an Additive Upgrade

Musings on Life, Aging, and Flexible Hybrid Electronics

I spent 35 years with DuPont, first working on printing, then on electronics, and finally serving customers in Silicon Valley. My career gave me a perspective and beliefs on the potential to use printing and additive processes to produce electronics…

Special Study: Assessment of the Flexible Hybrid Electronic Ecosystem

In May 2022, NextFlex commissioned a study to gain insight into the Flexible Hybrid Electronics (FHE) manufacturing ecosystem along with the markets and plans for commercialization. Input was obtained from member and non-member companies to create a…

Printing on Flexible Substrates and Beyond!

The zero-gravity environment of space presents inherent obstacles in performing day-to-day tasks and this is something scientists have been grappling with for decades. Satellite technology, human exploration, the milestones overcome in this industry…

Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body

NextFlex News – October 2022

One of the best parts of my job is when I get the opportunity to meet with young minds and show them how much manufacturing means to me. Because of the pandemic, we have unfortunately not been able to welcome students into our headquarters for the last…

NextFlex and AFRL Host Tech Sprint

A two-day intensive workshop focused on fatigue monitoring of airmen concluded recently at AFRL in Dayton, OH. The Sprint involved 38 individuals working collaboratively on concepts that have the potential to serve pilots’ needs.

An Interview with Dr. Andrew Kwas, NG Fellow 2, Northrop Grumman

I am a NG Fellow 2 at Northrop Grumman Corporation in the Space Systems Sector, and in the Office of the Chief Engineer in the Tactical Space Systems Division. Our organization contributes to our Corporate Global Security Leadership position. Our Company…

Advancing FHE Performance with Novel Materials

Creating and maintaining a robust commercial ecosystem around flexible hybrid electronics (FHE) is one of NextFlex’s primary goals. To help achieve this, we coordinate eleven technical working groups (TWGs) made up of devoted NextFlex members and government…

NextFlex News – September 2022

Last week NextFlex participated in the 33rd IEEE Electronics Packaging Symposium held at Binghamton University. Dr. Scott Miller, Director of Technology; Robert McManus, Engineering Manager, Software and Test; and Dr. Janos Veres, Director of Engineering…

NextFlex News – August 2022

On August 2, 287 NextFlex members and government partners gathered, in-person and virtually, for Innovation Days 2022: two days of presentations, demonstrations, and a celebration of results of the past year. This year’s event featured a keynote presentation…

Institute Facilities Are a Draw for Many Early-Stage Companies

Pentagon’s R&E Enterprise Confronts Emerging Tech Manufacturability Gaps

NextFlex Announces New Affiliated Missouri FHE ‘Node’