NextFlex News – February 2023

Dear Members and Friends,

I’m looking forward to hosting you on March 28-29 at the NextFlex Winter Symposium here at the Technology Hub. Not only will we be launching our eighth project call in conjunction with the event, we also will be hosting a Proposer’s Day and Teaming event at the Symposium. In addition, we will have invited technical talks and will present updates from NextFlex as well as funded project updates. The PC 8.0 events are open to all, so I hope you’ll join us. Portions of the event will be member-only, so if you’re considering membership, now is the time to act. More information, including how to register, may be found here.

Also, later today at 10:00 am Pacific, NextFlex will host a report-out on the workshop held last month entitled, “Applications of Hybrid Electronics for Advanced Packaging.” Over 100 subject matter experts convened at NextFlex January 18-19 to explore and align opportunities for flexible and additive hybrid electronics for semiconductor packaging. Attendees broke into four groups to identify and prioritize solutions for how the FHE community can shape the future of US packaging capabilities. Four key themes were addressed by the participants: Direct Write Interconnects; Substrates and Buildup Layers; Interposers, Bridges & Architectures, and Circuitization. The webinar later today will report out on the findings from the workshop. More information, including how to register, may be found here.

Finally, we were fortunate to host students from Jim Burnham’s Mechatronics Engineering class at MetroED in San Jose, CA, last week. The students toured the Technology Hub, viewed FHE-enabled demonstrators, and asked questions of NextFlex engineers during a panel discussion. Students especially enjoyed hearing about the education pathways that led the engineers to their roles. Time and again we see the excitement building as the students progress through their FlexFactor® experience, and we love to have them visit us at NextFlex.

Stay well and thank you for your support.

Sincerely,

Malcolm J. Thompson, Ph.D.