Project Call 10.0

About

NextFlex Project Calls fulfill one of the Institute’s primary goals: fostering technology innovation and commercialization.

Project Call (PC) 10.0 is the tenth project call issued by NextFlex. Like the previous project calls, it is intended to advance the state of the art in manufacturing for hybrid electronics and to promote the strength, competitiveness, and interconnectedness of the U.S. manufacturing ecosystem for hybrid electronics. Each NextFlex project call builds from and implements changes relative to past project calls, and all proposers should carefully read all sections of this guidebook to understand changes in proposal development, required content, submission, evaluation, eligibility, and selection criteria. Important considerations for PC 10.0:

• Proposal process will be 1-stage (straight to full proposal) – there is no pre-proposal round
• Discussion with NextFlex during proposal development is strongly encouraged to ensure that proposals align to the goals of the topics
• Projects are expected to be technically focused and of modest duration (maximum duration from 12 to 18 months, by topic)
• Topic areas are broadly defined, allowing proposers to determine the specific subject of their proposal; proposals should explain the importance and relevance of the chosen subject
• Alignment of proposals to DoD Critical Technology Areas and other DoD priorities are strongly encouraged (for more information, see https://www.cto.mil/usdre-strat-vision-critical-tech-areas/)
• Projects that leverage prior NextFlex investments are encouraged. All projects should have meaningful impact on U.S. hybrid electronics manufacturing and technology.

Topics for PC 10.0 include:

• Topic 10.1: Maturing and Derisking Hybrid Electronics Manufacturing Processes and Devices
• Topic 10.2: AI/ML for Design, Manufacturing, and Qualification of Hybrid Electronics
• Topic 10.3: Hybrid Electronics Platform Demonstrator
• Topic 10.4: Additive Manufacturing and Repair of Electronics in the Defense Industrial Base
• Topic 10.5: Platform Demonstrator for Reduced Life Cycle Costs and Improved DoD Readiness
• Topic 10.6: Open Topic for “New Project Leads”

NextFlex will be hosting a Proposer’s Day and Teaming Event on March 27, 2024 from 8 AM to 12 PM Pacific, both virtually and at the NextFlex office in San Jose, CA. Click here to register.

The teaming event will provide attendees with the opportunity to share their proposal ideas, technical capabilities, and connect with potential project collaborators.

Each proposer will be allowed a single slide and two minutes to pitch their proposal idea or interest in joining a proposal team. Proposers may pitch ideas for multiple topics, but this may be limited based on total number of proposers.

If you would like to participate in this event, please attach your PowerPoint slide to this form and submit it by Monday, March 24.

PROJECT CALL REFERENCE DOCUMENTS

• Project Call 10.0 Cover Sheet Submission Form
• Project Call 10.0 Proposal Submission Form
• Project Call 10.0 Guidebook
• Project Call 10.0 FAQs
• Cost Proposal Template
• Project Call 10.0 Summary PPT Template
• Cost Share Definitions and Guidance
• Hybrid Electronics Manufacturing Roadmap Summary
• Manufacturing Readiness Level (MRL) Webinar
  In March 2023, NextFlex hosted a webinar on MRLs, including MRL & TRL background, classifications/substantiation, and how they can be used within NextFlex Project Call proposals. View Webinar Slides | View Recorded Session
• PC 10.0 Virtual Proposer’s Day & Teaming Event Registration